1. SMT chip processus link: solidarius crustulum agitatione → solida crustulum excudendi → SPI → adscendens → refluxus solidatorium → AOI → rework.
2. DIP obturaculum-in processui nexum: obturaculum in → unda solidatorium → pes secans → post-glutinos processus → tabula lotio → qualitas inspectionis.
3. PCBA test: PCBA test dividi potest in ICT test, FCT test, senescit probatio, vibratio test, etc.
4. Finis operis conventus: Testam probatae PCBA tabulae convoca, eam proba, et tandem vehi potest.
Post tempus: May-23-2022